Thick copper and high current (coil) substrate manufacturing service
Many research institutions and universities are utilizing it for research and development!
Our company manufactures "thick copper and high current (coil) substrates," which allow for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the difference between the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ As a printed circuit board, the conductor thickness, circuit width, layout, and dielectric properties can be freely modified according to the required specifications. ■ Suitable for prototyping and development purposes. *For more details, please download the PDF or feel free to contact us.
- Company：関西電子工業
- Price：Other
